Substrate to 2.5 times, one prepay is 1.1 billion dollars

This IT Home page is stamped 2026/10/22 15:09:45. NVIDIA said on the 21st, local time, that it is expanding global manufacturing with six supply-chain partners. Three of the six deals focus on substrates. The other three are advanced packaging, semiconductor test, and co-packaged optics. The page gives the reason as keeping up with demand for its accelerated computing and AI factory platform. That is the announcement's wording. Whether any more capacity can be delivered today is not printed.

On substrates, NVIDIA plans to raise the substrate capacity its products need to 2.5 times within three years. Under an agreement Ibiden disclosed earlier this year, NVIDIA supports added capacity at the Ono plant in Japan with a prepay of several billion dollars. This page does not turn several billion into a finer figure. The expansion brings 2 times the additional capacity, expected to come online gradually from the first quarter of 2028. Samsung Electro-Mechanics joins the substrate supply chain and starts shipping now. The work covers upgrades and new projects at Sejong and Busan. By 2028, NVIDIA is expected to take a substantial share of Samsung Electro-Mechanics' packaging-substrate capacity. No percentage is printed. Unimicron's KF substrate expansion is expected to ramp in the second quarter of 2027 and reach full output in 2028.

On advanced packaging, NVIDIA plans to expand capacity in South Korea with Amkor, with a target of raising interposer-wafer capacity by more than 300 percent by the end of 2028. Test demand is expected to double across 2026 and 2027. That is an expectation, not a tally of orders already settled. The company is paying KYEC a 1.1 billion dollar prepay to support volume production at new Singapore capacity in February 2027 and new US capacity in April of the same year. The yuan conversion attached on the page is not in this story.

On optics, NVIDIA plans a large rise in CPO optical-engine capacity with SPIL. The target is 15 times by the middle of 2027, then another doubling by the end of 2028. Both the 15 times and the later doubling are targets, not output this page measured. How the plants are built, and how the process runs, is not written here.

Of the six, the substrate three are Ibiden, Samsung Electro-Mechanics, and Unimicron. The other three, by the split on this page, are Amkor, KYEC, and SPIL. The prepays are written two different ways. Ibiden's is several billion dollars, with no finer number. KYEC's is 1.1 billion dollars. Neither should be read as revenue from goods already delivered. The 2.5 times, the extra 2 times of capacity, the more than 300 percent, the 15 times, and the later doubling are all written as plans or targets. The dates fall in 2027 and 2028, not as output on 22 October.