Rohan Paul

tomshardware: TSMC says it will stay a pure logic foundry, denying a report that Nvidia pushed it toward 3D DRAM. There was a report that TSMC began drafting 3D DRAM plans after a request from Nvidia, its largest customer. Nvidia has reason to look, because AI demand has drained DRAM supply and turned memory into the part that decides whether accelerators ship. 3D DRAM stacks memory cells vertically to raise capacity per wafer, yet even Micron plans at least 4 more planar nodes before adopting it. That timeline means a TSMC entry couldn’t ease shortages for at least 5 years, and TSMC lacks a competitive planar DRAM process to build from. Instead, it already profits from memory without making it, by building HBM base dies and bonding memory to logic with SoIC hybrid bonding. Separately, a Korean report says Nvidia wants Samsung, SK hynix and Micron to build its custom NVHBM base dies on TSMC’s 3nm process, which would give TSMC memory revenue without DRAM’s price swings.